3M Wafer De-Taping Tape 3305, 25 mm x 100 m

Details

• Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
• Good holding power
• High instant adhesion to substrate
• Transparency allows for inspection without tape removal

Product Name: 3M™ Wafer De-Taping Tape 3305, 25 mm x 100 m

Product Description: 3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.

Technical Specifications:
- Country of Origin: Japan
- ECCN Number: EAR99
Logistics and Handling:
- 3M Stock: 7010321285
- Legacy Stock Number: JT200085234
- 3M Catalog Number: 3305
- Sales UOM: Roll
- Sales UPC: 04548623422213 (548623422213)
- Smallest Saleable Unit UPC: 54548623422218 (548623422218)
- Shipper UPC: 54548623422218 (548623422218)
- Typical Lead Time: 82 Days
- Shelf Life: 365 Days
- United States Department Of Transportation Ground (US DOT, 49 CFR): NOT REGULATED
- International Air Transport Association: NOT REGULATED
Additional Information: A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.

Important Links:

Tech Data Sheet