3M Thermally Conductive Acrylic Interface Pad 5500H-05, 240 mm x 60 m, 1 Roll/Case, Restricted
Details
- Good flame retardant, UL 94 V-0 equivalent material
- Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
- High thermal conductivity
Product Name: 3M™ Thermally Conductive Acrylic Interface Pad 5500H-05, 240 mm x 50 m
Product Description: 3M™ Thermally Conductive Acrylic Interface Pad 5500H is a very conformable and soft pad with high thermal conductivity of 3.0 W/m-K (3M test method). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
3M™ Thermally Conductive Acrylic Interface Pad 5500H has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. This pad performs well in high temperatures, maintaining its thermal conductivity and softness up to 130?. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
Technical Specifications:
- Country of Origin: Japan
- ECCN Number: EAR99
Logistics and Handling:
- 3M Stock: 7100123151
- Legacy Stock Number: JT940009205
- Sales UOM: Roll
- Sales UPC: 04549395494880 (549395494880)
- Smallest Saleable Unit UPC: 54549395494885 (549395494885)
- Shipper UPC: 54549395494885 (549395494885)
- Typical Lead Time: 68 Days
- Shelf Life: 365 Days
- United States Department Of Transportation Ground (US DOT, 49 CFR): NOT REGULATED
- International Air Transport Association: NOT REGULATED
Additional Information:
3M™ Thermally Conductive Acrylic Interface Pad 5500H has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. This pad performs well in high temperatures, maintaining its thermal conductivity and softness up to 130?. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
Important Links:
Tech Data Sheet
